We will introduce processing and observation methods using mechanical polishing, SEM, and EDX!
Here is an example of failure analysis of chip resistors where abnormalities were observed.
Upon investigating the cause of malfunction in the polishing table, abnormalities were confirmed in the chip resistors on the relevant board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melted. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal area, raising suspicions that the undercoat layer may be exposed.
Next, cross-sectional samples were prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which showed that the protective film and resistive material appeared to be melted.
At Aites, we consider and propose processing, pretreatment, observation methods, and combinations tailored to the observation objectives and the composition and structure of the samples based on our accumulated know-how. Please feel free to contact us for consultations.
[Analysis Content]
■ Surface Observation
■ Cross-sectional Observation
*For more details, please download the PDF or feel free to contact us.
